NXP secures €1 billion loan from EIB for semiconductor R&D in Europe
The loan aims to advance NXP's research in automotive, industrial and IoT semiconductor solutions across European countries until 2026
As reported in a press release on Jan. 16, NXP Semiconductors has announced a significant boost to its research, development, and innovation (RDI) efforts through a €1 billion loan from the European Investment Bank (EIB).
Thank you for visiting S&P Global AutoTechInsight.
*A subscription to News & Analysis includes four S&P Global-selected sector-specific analytical pieces per month. Access to all analytic pieces across all domains comes with a subscription to All Domains. Please click here to subscribe.
To get access to the AutoTechInsight full suite of services, please contact a sales representative by clicking here.
Already a subscriber? Please log in here