Trilumina unveils surface-mount flip-chip back-emitting VCSEL array
The new device enables low cost, high performance over existing designs using near-infrared light-emitting laser diodes or LEDs for 3D sensing
TriLumina, a developer of flip-chip VCSEL (vertical-cavity surface-emitting laser) technology for 3D sensing, has unveiled what it claims to be the world’s first surface-mount flip-chip back-emitting VCSEL array without the need for a submount or bond wires, according to a company press release last month
Thank you for visiting S&P Global AutoTechInsight.
*A subscription to News & Analysis includes four S&P Global-selected sector-specific analytical pieces per month. Access to all analytic pieces across all domains comes with a subscription to All Domains. Please click here to subscribe.
To get access to the AutoTechInsight full suite of services, please contact a sales representative by clicking here.
Already a subscriber? Please log in here
