Ansys, Intel Foundry collaborate on multiphysics analysis solution for EMIB 2.5D assembly technology
Ansys' collaboration to expand from single-die system-on-chip to include Intel’s EMIB assembly technology
Ansys and Intel Foundry have collaborated to provide multiphysics sign-off solutions for Intel’s innovative 2.5D chip assembly technology, which uses embedded multidie interconnect bridge (EMIB) technology to connect the die flexibly and without the need for through-silicon vias (TSVs), according to a press release on Feb. 22.
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