Ansys, Intel Foundry collaborate on multiphysics analysis solution for EMIB 2.5D assembly technology
Ansys' collaboration to expand from single-die system-on-chip to include Intel’s EMIB assembly technology
Ansys and Intel Foundry have collaborated to provide multiphysics sign-off solutions for Intel’s innovative 2.5D chip assembly technology, which uses embedded multidie interconnect bridge (EMIB) technology to connect the die flexibly and without the need for through-silicon vias (TSVs), according to a press release on Feb. 22.
Thank you for visiting S&P Global AutoTechInsight.
*A subscription to News & Analysis includes four S&P Global-selected sector-specific analytical pieces per month. Access to all analytic pieces across all domains comes with a subscription to All Domains. Please click here to subscribe.
To get access to the AutoTechInsight full suite of services, please contact a sales representative by clicking here.
Already a subscriber? Please log in here
