UCIe Consortium releases 2.0 specification supporting manageability system architecture and 3D packaging
The new UCIe 2.0 specification introduces enhancements for SiP manageability and 3D packaging, promising higher bandwidth density and power efficiency
According to a press release on Aug. 1, the Universal Chiplet Interconnect Express (UCIe) Consortium has officially unveiled its 2.0 specification, marking a significant upgrade in its offerings.
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