Rapidus partners with IBM in 2nm chiplet mass production
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology
Rapidus Corp., a manufacturer of advanced logic semiconductors, and multinational technology company IBM announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space, as reported in a press release June 3.
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