SK hynix signs investment agreement of advanced chip packaging with Indiana
The supplier will build an advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D
SK hynix, a supplier of high-bandwidth memory (HBM) chips, announced that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, the first of its kind in the United States, is expected to drive innovation in the nation’s AI supply chain, while bringing more than 1,000 new jobs to the region, as reported in a press release on April 3.
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