US to fund Amkor up to $400 million for chip-packaging plant
This Arizona facility, supported by US grants and potentially loans, aims to advance chip packaging for tech such as 5G and AI, with Apple as a prime client
The US Commerce Department announced its intention to allocate up to $400 million in government grants to Amkor Technology for the development of a $2 billion advanced semiconductor packaging facility in Arizona, US, Reuters reported July 26.
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