Infineon Technologies, in collaboration with MediaTek and its design house partners, has developed an innovative cockpit solution that reduces the bill of materials (BOM) for both hardware and software. The solution utilizes Infineon's Traveo CYT4DN microcontroller (MCU) family and MediaTek’s entry-level Dimensity Auto system-on-chip (SoC). In this easy-to-use cockpit solution, Infineon’s CYT4DN MCU acts as a safety companion to the SoC, ensuring the ASIL-B safety target for automotive clusters. The system maintains functionality and safety in case of errors while reducing overall system costs.
“Our automotive SoC, combined with Infineon’s Traveo T2G MCU, will provide a cost-effective cockpit solution that delivers new possibilities to OEMs and Tier 1 companies,” said Xiong Jian, vice general manager of the Automotive product line at MediaTek. “This option will greatly boost the performance and capabilities of the cockpit in entry-level car models.”
The new cockpit solution supports a resolution of 1,920 x 720 pixels for instrument clusters and the in-vehicle infotainment display. The solution is cost-efficient as it leverages the open-source Android operating system, eliminating the need for expensive commercial operating systems and hypervisors. This simplifies software development, significantly reduces software costs, and allows manufacturers and suppliers to maintain and update the software independently.
