SK Hynix joins hands with TSMC to strengthen high-bandwidth memory technological leadership
The two companies will first focus on improving the performance of the base die that is mounted at the very bottom of the HBM package
SK hynix Inc. on April 19 announced that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation High Bandwidth Memory (HBM) and enhance logic and HBM integration through advanced packaging technology.
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