Chiplets: Tiny building blocks can make a big difference

Attaining this higher level of computing can be accomplished by developing more complex monolithic integrated circuits (ICs), using the most advanced manufacturing process nodes. This is the traditional Moore’s Law approach, or by using more advanced packaging and testing (APT). APT can co-package multiple dies into a single package to replicate the functioning of a monolithic IC. It also allows the combination of ICs to closely resemble a single-chip MCU. For example, a system-on-chip (SoC) can be co-packaged with the requisite discrete memory and storage ICs. The resulting chiplet design — a modular approach characterized by heterogeneous integration — provides a way to increase the number of transistors and components without confronting the inherent physical constraints of a singular chip. This methodology is progressively employed in various supercomputing applications, and it is incumbent for the automotive industry not to lag in its adoption.

The automotive industry is currently experiencing profound shifts, ranging from electrification to the introduction of innovative vehicle features. Central to these transformations is the escalating importance of semiconductors. Traditional computing capacities housed in electronic control units (ECU) based on microcontroller units (MCUs) are rapidly becoming inadequate in the face of the expanding computational demands brought on by advanced driver-assistance systems (ADAS), communication protocols and upcoming infotainment functionalities in vehicles. It is evident that only high-performance computing can fulfil these intricate demands.