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Nexperia, Netherland provides CFP15B clip-bond FlatPower package to leading tier-1 supplier

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Corporate developments

The CFP15B is made of the highest quality materials

According to an official press release dated 10 September, Nexperia, the expert in essential semiconductors, has announced that one of its surface-mount device packages, the clip-bond FlatPower package CFP15B, has been tested for the first time by a leading tier-1 supplier for Board Level Reliability (BLR) for automotive applications.

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