Source: Getty Images/Sven Loeffler

The advanced BMS is set to become available for OEM evaluation and development in the second quarter of 2025

NXP Semiconductors, a key player in providing innovative solutions for the automotive market, has introduced an industry-first ultra-wideband (UWB) wireless battery management system (BMS) solution, revolutionizing the assembly and functionality of electric vehicles. Unveiled at Electronica in Munich on Nov. 12, this solution aims to streamline the manufacturing process of EVs, promoting faster adoption through simplification and efficiency.

The UWB wireless BMS is designed to facilitate a more robust and reliable transfer of data within battery packs, crucial for measuring variables such as temperature and voltage without conventional wiring systems. This wireless communication technology not only enhances performance and safety, but significantly cuts down on manufacturing complexity and costs by decoupling mechanical and electrical development. It also fosters a quicker time-to-market for EV manufacturers, ensuring scalability across various platforms without compromising on system efficiency.

One of the standout benefits of NXP's UWB wireless BMS is its elimination of extensive wiring harnesses, which traditionally contribute to labor-intensive assembly and potential for errors. By removing these physical connections, the solution allows for a higher energy density in battery packs, directly impacting the vehicle's range and performance.

According to Naomi Smit, general manager and vice president of Battery Management Systems at NXP, the use of Trimension UWB technology ensures superior wireless communication within the BMS, setting a new standard over existing narrow-band-based solutions.

The technological innovation behind the UWB wireless BMS is set to become available for original equipment manufacturer evaluation and development in the second quarter of 2025. It is a significant component of NXP's FlexCom chipset, which supports both wired and wireless BMS configurations. This chipset underscores the flexibility it offers to OEMs and tier 1 suppliers in choosing vehicle architecture and technology, aided by a common software architecture and safety libraries that facilitate software reuse across different platforms, further minimizing development efforts.

Moreover, the FlexCom BMS chipset incorporates NXP's MC33777 Battery Junction Box (BJB) integrated circuit, catering to high-voltage systems with accurate readings for voltage, chassis isolation and current. This integration highlights the versatility of NXP's BMS solutions, capable of supporting both wired and wireless setups as part of a comprehensive turnkey management system. This development positions NXP as a pivotal contributor to the EV market, committed to advancing wireless technologies and supporting the transition toward more sustainable electric mobility.

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