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    Major revision for global light vehicle production forecast – what it means for OEMs’ technology deployment
    The IHS Markit light vehicle production forecast has been cut by 6.2% or 5.02 million units in 2021, and by 9.3% or 8.45 million units in 2022, to stand at 75.8 million units and 82.6 million units, respectively. For 2023, we have reduced the forecast by 1.05 million units or 1.1% to 92 million unit...
    What Fit for 55 means for all member nations in the European Union
    Unveiling a roadmap to make Europe the world’s first climate neutral continent by 2050, the European Commission rolled out the ‘Fit for 55’ package on 14 July 2021, proposing that the suggestions made by the governing body be made legally binding for all members of the European Union (EU). ...
    19-Aug-2021 Insights Policy & Regulation Pinned
    Vishay develops new surface-mount small signal diodes
    Vishay Intertechnology has developed surface-mount small signal diodes in ultra compact DFN1006-2A plastic package with wettable flanks, it said in a press release on 11 October. The 40 V BAS40L Schottky and 100 V BAS16L switching diodes are used for automotive applications. It measures 1 mm by 0.6 ...
    15-Oct-2021 News New Products
    SEA-NI V2X Bench Tester and the SEA-NI V2X Sniffer gets OmniAir Qualified Test Equipment certification
    NI and S.E.A. have jointly announced that SEA-NI V2X Bench Tester and the SEA-NI V2X Sniffer have received OmniAir Qualified Test Equipment (OQTE) certification, according to a press release on 12 October. The products become the first modular bench test solution for cellular vehicle-to-everything (...
    MIPI Alliance completes development of A-PHY v1.1 to help automakers with high-performance image sensors and displays
    According to a press release on PR Newswire dated 11 October, The MIPI Alliance announced that development on A-PHY v1.1, the next version of the automotive serializer-deserializer (SerDes) physical-layer interface, has been completed. Version 1.1 will increase the maximum available downlink data ra...
    14-Oct-2021 News New Products
    Startup Hailo raises USD136 million series C funding to fuel AI chip production
    According to a press release published on 11 October in the electronic weekly, Hailo, an artificial intelligence (AI)-focused chipmaker based in Israel, has raised USD136 million in a private funding round led by Poalim Equity and Gil Agmon. Existing investors included Israeli entrepreneur a...
    Aptiv expects FY 2021 sales in the range of USD15.1 billion to USD15.5 billion
    Aptiv has revised its financials for the full year, it said in a press release on 11 October. Aptiv says its full year 2021 sales has been revised in the range of USD15.1 to USD15.5 billion, versus a previous range of USD16.1 to USD16.4 billion. Adjusted operating income margins are expected to be i...
    Trustonic joins Renesas R-Car consortium to increase the availability of cybersecurity solutions in the connected vehicle market
    Trustonic announces the availability of Kinibi 510 on Renesas' R-Car Gen3 automotive reference platform in an official press release dated 7 October. This advancement will facilitate and support collaboration and partnerships within the connected car and electric vehicle (EV) ecosystems. Andrew T...
    Infineon launches SLS37 V2X hardware security module
    Infineon Technologies announced the SLS37 vehicle-to-everything (V2X) hardware security module (HSM), a plug-and-play security solution for vehicle-to-everything communication, in an official press release dated 11 October. The SLS37 V2X HSM is built around a highly secure, tamper-resistant micro...
    12-Oct-2021 News New Products
    AutoTechInsight Weekly –11 October 2021
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    Nissan Mexico to halt production due to chip shortage
    According to a Reuters press release dated 6 October, Japanese automaker Nissan will implement temporary work stoppages at two Mexican plants for several days in October due to production adjustments required to manage a semiconductor chip shortage, its Mexico unit said. "We continue to make adju...
    Chipmaker Infineon plans 50% investment boost
    According to a Reuters press release dated 6 October, German chipmaker Infineon Technologies plans a 50% increase in investments next year, boosting its shares as it looks to benefit from soaring demand and a global semiconductor shortage. Infineon stated that it will invest approximately EU...
    08-Oct-2021 News Investments
    Infineon develops new V2X hardware security module
    Infineon Technologies has developed the SLS37 V2X hardware security module security solution for vehicle to everything communication (V2X), it said in a press release on 4 October. The SLS37 V2X HSM is based on a tamper resistant microcontroller for security needs in V2X applications within telemati...
    07-Oct-2021 News New Products
    NXP and partners test Advanced V2X scenarios for collision-free driving
    According to a press release published on GlobeNewswire on September 6th, NXP will demonstrate new safety scenarios enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X) at this year's ITS World Congress in Hamburg. NXP will collaborate with partners such as premium manufacturer Riese...
    07-Oct-2021 News New Products
    Renesas launches automotive gateway solution based on new R-Car S4 SoCs and PMICs
    Renesas unveiled an innovative automotive gateway solution with R-Car S4 system-on-chip (SoCs) and power management ICs (PMICs) for next-generation vehicle computers, communication gateways, domain servers, and application servers in an official press release dated 6 September. Renesas' new ...
    Renesas support ISO/SAE 21434 standard for future automotive microcontrollers and system on chip devices
    According to a press release issued on 6 September, Renesas announced its full commitment to meet the ISO/SAE 21434 road vehicles cybersecurity engineering international standard for its automotive microcontrollers (MCUs) and system-on-chip (SoC) solutions beginning with new developments in January ...
    indie Semiconductor creates business unit for perception-enabled, vision processing solutions for ADAS
    indie Semiconductor has created a business unit focused on high quality perception-enabled, vision processing solutions to address use cases for advanced driver-assistance systems (ADAS)-enabled vehicles, it said in a press release on 5 October. Ramesh Singh will lead indie’s new VisionQ business ...
    Bosch Engineering GmbH rejigs top leadership
    Automotive engineering and development service provider Bosch Engineering GmbH has restructured its top leadership team with effect from 1 October, the company said in a press release on 5 October. The company said that Dr. Johannes-Jörg Rüger, who will continue to serve as the president of Bos...
    Major revision for global light vehicle production forecast – what it means for OEMs’ technology deployment
    The IHS Markit light vehicle production forecast has been cut by 6.2% or 5.02 million units in 2021, and by 9.3% or 8.45 million units in 2022, to stand at 75.8 million units and 82.6 million units, respectively. For 2023, we have reduced the forecast by 1.05 million units or 1.1% to 92 million unit...
    Spark connected and TDK launch new automotive In-Cabin wireless charging solution
    According to press release on Business wire dated 4 October, Spark Connected announced the launch of The Beast 2.0—an automotive in-cabin wireless charging solution with TDK’s newest pattern coil technology. According to Ruwanga Dassanayake, COO at Spark Connected, “After the market su...
    05-Oct-2021 News New Products
    Henkel develops one-component UV cured in place gasketing product for electrical components
    Henkel Adhesive Technologies has developed Loctite AA 5885, a one-component polyacrylate cured in place gasketing product to protect sensitive automotive electrical components, it said in a press release on 4 October. Henkel says the new product offers durability even when exposed to high pressur...
    05-Oct-2021 News New Products
    Infineon develops half-bridge power module for inverter applications in EVs
    Infineon Technologies has developed automotive qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module, it said in a press release on 4 October. The module is optimized for inverter applications in hybrid and electric vehicles. Infineon will expand its product portfolio to in...
    05-Oct-2021 News New Products
    ASMPT announces agreement to acquire AEi to offer automated and scalable end-to-end camera module assembly
    According to an official press release dated 30 September, ASM PACIFIC TECHNOLOGY LIMITED and Mycronic Group signed a definitive agreement under which ASMPT will acquire Mycronic's subsidiary Automation Engineering, Inc. ('AEi') in an all-cash transaction. The transaction has been approved by each c...
    Qualcomm, SSW Partners to buy Veoneer in USD4.5 billion deal
    According to an official press release from Veoneer dated 4 October, chipmaker Qualcomm Inc. and SSW partners have agreed to buy Swedish automotive technology group Veoneer for USD4.5 billion. SSW Partners will collaborate with Veoneer's management to ensure the continuation of Veoneer's cur...
    Continental, Horizon Robotics form JV to develop ADAS solutions
    Continental has announced that it has signed a joint venture (JV) agreement with Horizon Robotics to develop advanced driver assistance systems (ADAS) and automated driving solutions, according to a company press release on 29 September. Continental will be the majority shareholder. The JV is expect...
    AutoTechInsight Weekly – 4 October 2021
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    HUBER+SUHNER supplies radar antennas to tier-1 automotive supplier
    According to an official press release dated 30 September, HUBER+SUHNER is supplying radar antennas to Continental from series production. Antennas that contribute significantly to next-generation radar applications are included in the scope of supply. HUBER+SUHNER will begin serial production of...
    Renesas Electronics to boost semiconductor supply capacity
    According to press release on NIKKEI Asia dated 30 September, Renesas Electronics, a Japanese chipmaker, announced plans to increase its capacity to supply a key component in cars and electronics by more than 50% by 2023, as some industry observers predict a global chip shortage will last into next ...
    NIO picks Keysight to verify 5G and C-V2X connectivity in EVs
    Keysight Technologies has announced that NIO has selected its solutions to verify 5G and cellular vehicle to everything (C-V2X) connectivity, according to a company press release on 29 September. NIO has picked Keysight’s solutions to advance development of premium electric vehicles (EVs) primaril...
    Automakers and suppliers to reinvent supply chain amid chip shortage
    Despite chip plants effectively running on full capacity, the global chip-shortage crisis may not be resolved next year, warned executives from German automotive companies during the IAA Mobility 2021 show in Munich. Top executives from several companies have publicly stated that they do not know...
    Toshiba ships pre-driver ICs for safety applications
    Toshiba has begun shipping TB9083FTG test sample, a pre-driver IC for automotive applications like brushless motors used in electric power steering systems and electric brakes, it said in a press release on 28 September. The company will provide final samples in January 2022 and will start mass prod...
    29-Sep-2021 News New Products
    TDK develops high-reliability chip beads for automotive applications
    TDK has announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, according to a company press release on 28 September. It is compatible with high-durability solder in 150°C environments. The devices can be used for automotive ...
    29-Sep-2021 News New Products
    HELLA posts 9.6% y/y increase in Q1 sales at USD1.72 billion
    HELLA has reported a 9.6% year-on-year (y/y) increase in sales for the first quarter at EUR1.47 billion (USD1.72 billion), according to a financial filing dated 28 September. Reported earnings before interest and taxes (EBIT) came in at EUR79 million compared to a loss of EUR115 million last year, w...
    Kendrion acquires 3T for electronics and embedded systems
    According to an official press release dated 21 September, Amsterdam, the Netherlands, Kendrion N.V., a leading developer, manufacturer, and marketer of high-quality electromagnetic systems and components for industrial and automotive applications, has acquired 3T, a software and electronics de...
    Renesas launches highly accurate, cost-effective pressure sensing solution for automotive applications
    Renesas Electronics Corporation announced the RAA2S425x family of ICs for automotive pressure sensing systems in an official press release dated 28 September. The new devices provide highly accurate amplification and sensor-specific signal correction in xEV/EV/FCEV pressure sensing braking, transmis...
    29-Sep-2021 News New Products
    Toshiba begins shipments of Pre-Driver IC for automotive brushless motors supporting functional safety
    Toshiba has begun shipping test samples of the "TB9083FTG," a pre-driver IC for automotive applications such as brushless motors for electric power steering systems and electric brakes, according to an official press release dated 27 September. Toshiba will ship final samples in January 2022, and ma...
    Texas Instruments develops 1.5-W isolated DC/DC bias-supply module for EVs
    Texas Instruments has developed a new 1.5-W isolated DC/DC bias-supply module for electric vehicles (EVs) and hybrid EVs, it said in a company press release on 27 September. The UCC14240-Q1 uses a proprietary integrated transformer technology to enable designers to cut their power solution size in h...
    28-Sep-2021 News New Products
    Keysight, NCUOSC to validate efficiency of GaN, SiC applications, accelerate 5G and EV innovation
    Keysight has announced a collaboration with National Central University Optical Sciences Center (NCUOSC) to work on the design and test validation efficiency of gallium nitride (GaN) and silicon carbide (SiC) applications, for 5G and electric vehicle (EV) innovation, a press release dated 27 Septemb...
    Faurecia launches public takeover offer for HELLA
    According to an official press release dated 27 September, Faurecia, through its wholly owned subsidiary Faurecia Participations GmbH, published the offer document for its cash voluntary public takeover offer for all outstanding shares of HELLA, a major automotive player in lighting and electronics ...
    Kongsberg Automotive lowers FY 2021 revenue guidance on persisting chip shortage
    Zurich-based Kongsberg Automotive has lowered its guidance on fiscal year (FY) 2021 revenue and adjusted earnings before interest and taxes (EBIT) on persisting industry challenges such as continuing semiconductor shortage along with surging raw material prices, the company said in a press rele...
    Robert Bosch Venture Capital launches new investment platform for China
    The corporate venture arm of the Bosch Group, Robert Bosch Venture Capital GmbH (RBVC) has set up its new investment platform called Boyuan Private Equity Capital Management Company Ltd. (or Boyuan Capital), based in Shanghai, the company announced on 27 September. Boyuan Capital will focus on ma...
    Vishay enhances automotive thick film chip resistor in 1206 case size
    Vishay Intertechnology has enhanced the Vishay Draloric RCC1206 e3 thick film chip resistor in the 1206 case size with a higher power rating of 0.5 W, it said in a press release on 22 September. The devices reportedly offer twice the power of standard thick film chip resistors in the same size, allo...
    27-Sep-2021 News New Products
    AutoTechInsight Weekly – 27 September 2021
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    HELLA lowers outlook for fiscal 2021/22 on reduced market expectations
    HELLA has slashed its outlook for the fiscal year (FY) 2021/22 owing to reduced market expectations because of worsening supply bottlenecks, especially for electronic components, the company said in a press release on 22 September. HELLA expects FY sales adjusted for currency and p...
    LG Electronics acquires Israel's cybersecurity platform developer Cybellum
    According to a press release published on TechCrunch on 22 September, LG Electronics expanded its component business for vehicle hardware and software by acquiring Israel's cybersecurity platform developer Cybellum in a deal worth approximately USD110 million.  LG Electronics announced the s...
    Toshiba develops simulation technology to shortens verification times for automotive semiconductors
    Toshiba Electronic Devices & Storage Corporation, according to an official press release dated 21 September, has developed a model-based development (MBD) simulation technology that reduces verification times for automotive semiconductors by approximately 90%. The technology enables automotive e...
    24-Sep-2021 News New Products
    Lear and Hu Lane Associate form JV to produce automotive connection systems
    Lear Corporation has announced the formation of a joint venture with Hu Lane Associate, according to a company press release on 22 September. The JV company will be initially based in Yangzhou, mainland China and manufacture a portfolio of connection systems products for vehicle architectures. ...
    STMicroelectronics develops intelligent high-side drivers for automotive applications
    STMicroelectronics has developed highly integrated intelligent high-side drivers for automotive applications, it said in a press release on 22 September. The VN9D30Q100F and VN9D5D20FN are designed for high-side connection in applications powered from a 12V battery. The devices simplify the hardw...
    23-Sep-2021 News New Products
    Cadence unveils platform for development of automotive systems
    Cadence Design Systems has unveiled the Cadence Helium Virtual and Hybrid Studio, according to a company press release on 22 September. The platform helps create virtual and hybrid prototypes of automotive systems. The studio enables early software bring-up for hardware-software co-verification and ...
    23-Sep-2021 News New Products
    Lotus cars to use Analog Devices’ wireless BMS
    Analog Devices announced in an official press release dated 22 September that renowned British performance brand Lotus Cars intends to incorporate ADI's wireless battery management system (wBMS) in its next-generation electric vehicle (EV) architecture. The wBMS from ADI was chosen due to its increa...
    Keysight ties up with Orolia to advance 5G LBS based on GNSS technologies
    Keysight has ted up with Orolia to develop 5G location-based services (LBS) based on global navigation satellite system (GNSS) technologies, it said in a press release on 21 September. The partnership will enable Keysight to expand its 5G device test solution portfolio with advanced GNSS simulation ...
    Nexperia, Netherland provides CFP15B clip-bond FlatPower package to leading tier-1 supplier
    According to an official press release dated 10 September, Nexperia, the expert in essential semiconductors, has announced that one of its surface-mount device packages, the clip-bond FlatPower package CFP15B, has been tested for the first time by a leading tier-1 supplier for Board Level Reliabilit...
    Magna and Veoneer announce expiration of waiting period under HSR Act
    According to an official press release dated 21 September, Magna and Veoneer announced that the waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976, or HSR Act, in connection with Magna's previously announced acquisition of Veoneer had expired. The waiting period expired...
    Merck to spend USD3.5 billion on electronics unit amid chip crunch
    Merck, a leading science and technology company, plans to invest significantly more than USD 3.5 billion in innovation and capacity of its Electronics business sector up to the end of 2025, according to an official press release dated 20 September. The company intends to spend more than EUR 2 billio...
    Xin Chi Technology partners with TINNOVE for automotive smart cockpits
    Xin Chi Technology has announced an agreement with TINNOVE in the field of automotive smart cockpits, according to a 17 September press release. The companies will leverage X9 series of smart cockpit chips from Xin Chi Technology and TINNOVE's OpenOS for advanced systems and high computing power int...
    AutoTechInsight Weekly – 20 September 2021
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    Horizon Robotics launches Journey 5 Processor for autonomous driving
    Horizon Robotics, a global leader in edge AI computing platforms for intelligent vehicles, unveiled its third-generation automotive-grade AI processor Journey 5, designed for Level 4 high autonomous driving, according to an official press release dated 5 August. It also unveiled TogetherOS, a real-t...
    20-Sep-2021 News New Products
    Infineon opens high-tech chip factory for power electronics in Austria
    According to an official press release dated 17 September, Infineon Technologies has opened a EUR1.6 billion (USD1.9 billion) plant in Austria, increasing the German semiconductor company's ability to supply power chips for cars, data centers, and renewable energy generation. The Villach pla...
    Showa Denko signs long-term supply contract for SiC epiwafers for power semiconductors with ROHM
    According to an official press release dated 13 September, Showa Denko has signed a long-term supply contract with ROHM, a Japanese semiconductor manufacturer that provides highly efficient silicon carbide (SiC) power semiconductors to the global market, to supply SiC epitaxial wafers for power...
    GlobalFoundries expands manufacturing features for automotive and others
    GlobalFoundries announced a portfolio of new features that extend its solutions roadmap and accelerate the next wave of innovation in chip design for smart mobile devices, data center, internet of things (IoT), and automotive in an official press release dated 15 September. "This past 18 months h...
    20-Sep-2021 News Investments
    GF and Synopsys deliver new reference flows for GF 22FDX process: first automotive flow for ASIL-D Designs
    According to an official press release dated 15 September, GlobalFoundries has qualified two key Synopsys reference flows for its 22FDX process: Amazon Web Services (AWS) qualification of the Synopsys reference flow enables scalable execution of in-system test, implementation, verification, ti...
    Vishay develops automotive thin film wraparound chip resistors
    Vishay Intertechnology has developed a new series of AEC-Q200 qualified, high power thin film wraparound chip resistors, it said in a press release on 15 September. The Vishay Dale Thin Film PHPA series devices feature a self-passivated tantalum nitride film for high moisture resistance. The devi...
    17-Sep-2021 News New Products
    Arm develops embedded edge architecture and two reference hardware platforms for automotive industry
    Arm has partnered with automotive suppliers to deliver a new software architecture and reference implementation, Scalable Open Architecture for Embedded Edge (SOAFEE), and two new reference hardware platforms, it said in a press release on 15 September. According to the Arm, it represents an acceler...
    17-Sep-2021 News New Products
    Indian government clears USD3.54 billion production-linked incentive scheme for auto industry
    The Indian government has on 15 September approved a production-linked incentive (PLI) scheme with an outlay of about USD3.54 billion (INR260 billion) to encourage domestic manufacturing capabilities of the automobile industry with a focus on futuristic technologies involving electric and hydrogen f...
    HELLA equips Mercedes EQA with lighting and electronics products
    HELLA has shown its lighting and electronics products with certain vehicles including the Mercedes EQA electric vehicle (EV), the supplier said in a press release on 15 September. Apart from new LED headlamps, the company developed a meter-long light strip for the front of the vehicle. The ligh...
    LIGENTEC and X-FAB to create Europe's largest capacity PIC foundry service
    German specialty semiconductor producer X-FAB Silicon Foundries announced via a press release on 14 September that it was partnering with Swiss photonic integrated circuits (PICs) manufacturer LIGENTEC to create Europe’s largest capacity foundry service for integrated photonic circuits. Ac...
    TDK launches new ceramic capacitors for automotive electronics applications
    Japanese multinational electronics company TDK announced via a press release on 14 September that it had expanded its CN series of multilayer ceramic capacitors (MLCCs) to include four new products, two of which are specifically designed for automotive passive electronics applications. The n...
    16-Sep-2021 News New Products
    Europe plans a Chips Act to boost semiconductor sovereignty
    According to a press release on ET Auto dated 15 September, the European Commission announced plans for a new chipmaking "ecosystem" to keep the EU competitive and self-sufficient after a global semiconductor shortage showed the hazards of relying on Asian and US suppliers. "We will pre...
    Renesas, OmniVision deliver integrated reference design for automotive camera systems
    According to an official press release dated 14 September, Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, introduced an integrated reference design for a high-...
    16-Sep-2021 News New Products
    Veoneer sticks with Magna offer after Qualcomm's revised bid, shares drop
    According to a press release on Yahoo Finance dated 14 September, Veoneer remains committed to the Magna offer after of Qualcomm's revised bid, causing the company's stock to fall. Qualcomm made a formal USD 37 per share bid for Veoneer on Monday, matching the offer made last month and exceeding ...
    BMW, GaN Systems signs semiconductor capacity agreement
    According to the official website, Canada-based GaN Systems announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors on September 14th. This has the potential to increase the efficiency and power density of c...
    Adac and Ainstein formalize JV to make smart molded parts
    Plastic parts supplier Adac Automotive Inc. and smart radar systems startup Ainstein Inc announced on 13th September that they had formalized their joint venture, Radac, to design, develop and manufacture mmWave radar-based sensing products. According to Plastics News, Radac will operate independ...
    Vishay develops new high current inductors
    Vishay Intertechnology has developed Automotive Grade IHLP low profile, high current inductor in the 19 mm by 19 mm by 7 mm 7575 case size, it said in a press release on 13 September. The new inductors have operating temperature of up to +155 °C for under the hood automotive applications. The new d...
    14-Sep-2021 News New Products
    General Motors invests in startup Oculii
    General Motors has made a multimillion dollar investment in startup Oculii, TechCrunch reported on 13 September. The investment could boost GM’s hands-free advanced driver assistance system known as Super Cruise. Oculii provides advanced artificial intelligence (AI) software for radar perception. ...
    14-Sep-2021 News Investments
    NXP selects TCS as a strategic partner to drive IT innovation
    According to press release on ETAuto dated 13 September, Tata Consultancy Services (TCS) said it will work with NXP Semiconductors to help accelerate its digital transformation. NXP is driving innovation in the automotive, industrial, and Internet of Things (IoT), mobile, and communication...
    TDK introduces new hall-effect sensors for hybrid and EVs
    Japanese multinational electronics company TDK announced via press release on 9 September that it had expanded its Micronas 3D HAL® sensor portfolio with the new HAR 3900 and HAR 3930 hall-effect sensors. According to the press release, the products enable stray-field compensated position d...
    13-Sep-2021 News New Products
    Intel to spend USD90 billion on chip plants in Europe over next 10 years
    According to press release on TechRadar dated 7 September, Intel has revealed plans to build new chip-making facilities in Europe with an USD95 billion funding plan over the next decade to boost the region's chip capacity. The commitment, announced by company CEO Pat...
    13-Sep-2021 News Investments
    IAA 2021: Siemens presents autonomous charging system
    According to an official press release dated 10 September, Siemens announced the Siemens Autonomous Charging System, which allows for fully automated charging of electric vehicles (EVs) ranging from cars to trucks. The prototype on display now has a charging capacity of up to 300 kW, but the company...
    13-Sep-2021 News New Products
    AutoTechInsight Weekly – 13 September 2021
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    AGP eGlass and WayRay partner for Holo-Windshield for holographic AR displays
    WayRay, the pioneering developer of the world's first holographic augmented reality head-up display (AR HUD) technology, has partnered with AGP eGlass, a global leader in state-of-the-art, specialty glass design and production, to drive the next generation of HUDs that will supercharge the driving e...
    BYD Semiconductor acquires major shares in Energen Semiconductor
    According to a press release published on Digitimes Asia on September 7th, BYD Semiconductor, a subsidiary of China-based carmaker BYD, has acquired a 77.75% stake in Jinan Energen Semiconductor for CNY5 billion (US774.8 million). Energen is a manufacturer of silicon (Si) and silicon carbide (SiC) p...
    Vishay develops new series of thick film chip resistors for EVs
    Vishay Intertechnology has developed a new series of AEC-Q200 qualified thick film chip resistors with operating voltages up to 3 kV, it said in a press release on 8 September. Devices in the Vishay Draloric RCV-AT e3 series have high operating voltages and can be used in place of standard resistor ...
    09-Sep-2021 News New Products
    Qualcomm, Google provide in-vehicle features to Renault Mégane E-TECH Electric
    According to an official press release issued on 6 September, Qualcomm Technologies announced at IAA 2021 that it will collaborate with Google and Renault Group to create a rich and immersive in-vehicle experience for Renault's next-generation electric vehicle. Renault Group will use Qualcomm Tec...
    ROHM and Geely signs strategic partnership agreement focused on SiC Power Devices
    According to an official press release dated 7 September, Semiconductor manufacturer ROHM and Geely Automobile Group Co., Ltd., a leading Chinese automobile manufacturer, have formed a strategic partnership to develop advanced automotive technologies. Both companies have been working together on ...
    TDK develops new miniaturized common-mode filters for automotive applications
    TDK Corporation has developed KCZ1210AH series of miniaturized common-mode filters for automotive applications, it said in a press release on 7 September. With a compact size measuring 1.25 x 1.0 x 0.5 mm, it allows for a smaller footprint on substrate and offers noise control function for different...
    08-Sep-2021 News New Products
    Antitrust authorities approve JV between Brose and Volkswagen
    According to an official press release issued on 7 September, antitrust authorities have granted all necessary approvals for the planned joint venture (JV) between Brose and Volkswagen, paving the way for the company to begin operations as planned in early 2022. Brose, SITECH aspires to be a global ...
    Valeo and Leoni announce partnership for zone controllers
    According to an official press release dated 7 September, Valeo, a leader in advanced driver assistance systems (ADAS) sensors and related functional software, and Leoni, a leading supplier of wiring systems and power distribution, will combine their strengths to bring the best in class solution for...
    Cicor selects SABIC’s LNP™ THERMOCOMP™ compounds to produce high-end 3D-MIDs
    Swiss circuit boards and hybrid circuits manufacturer Cicor announced on the 2 September that it had selected Saudi chemical manufacturing company’s LNP™ THERMOCOMP™ compounds to produce its portfolio of high-end 3D molded interconnect devices (3D-MIDs). According to the press release from ...
    Mercedes-Benz presents VISION AVTR concept vehicle with BCI at IAA Mobility 2021
    According to official press release dated 6th September, Mercedes-Benz announced that it is integrating the first Brain-computer interfaces (BCI) approaches into its pioneering VISION AVTR concept vehicle. The first approaches to mind control based on visual perception will be demonstrated at the...
    07-Sep-2021 News New Products
    AutoTechInsight Weekly – 06 September 2021
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    IAA 2021: HELLA to showcase automotive lighting and electronics solutions
    HELLA will be showcasing its automotive lighting innovations and products at the IAA Mobility 2021 in Munich, Germany, the company said in a press release on 3 September. HELLA will showcase chip-based headlamp technology ‘Solid State Lighting|High Definition’ (SSL|HD). It features SSL micro-LED...
    06-Sep-2021 News New Products
    Chinese chipmaker SMIC to invest USD8.87 billion in new semiconductor plant in Shanghai
    According to a press release published on Yahoo News on 3 September, mainland China's largest chipmaker Semiconductor Manufacturing International Corp (SMIC) announced plans to invest USD8.87 billion in a new semiconductor plant in Shanghai, as Beijing grapples with a US blacklist and a global chip ...
    Continental's sensIC project integrates printed electronics into rubber
    German automotive parts manufacturer Continental announced on 2 September that it had initiated research project sensIC at the Center for Functional Printing Technologies in Freiburg, Germany, toward integrating rubber components with sensor technology. According to the company’s press rel...
    06-Sep-2021 News New Products
    Bosch Chassis Systems expert Liming Chen joins AI chip startup Horizon Robotics
    Horizon Robotics, a Beijing-based domestic chip supplier, announced on 1 September that it had appointed Liming Chen, formerly head of the Bosch Chassis Control System R&D Center, as president of the company. According to iNews, the founder and CEO of Horizon Robotics, Kai...
    Tata Motors forecasts semiconductor shortage to impact offtake volumes in coming months
    Indian vehicle manufacturer Tata Motors Ltd forecasts that semiconductor shortage would continue to impact its monthly production schedules in the coming months. In a regulatory filing on 1 September, the company said that while semiconductor shortage continues to impact the vehicle production globa...
    Xilinx and Motovis develop solution to enhance automotive forward camera systems
    Xilinx has partnered with Motovis to develop a solution specifically for forward camera systems’ vehicle perception and control, it said in a press release on 31 August. The solution combines the Xilinx Automotive Zynq system-on-chip platform and Motovis’ convolutional neural network IP. ...
    01-Sep-2021 News New Products
    Diodes develops current limit power switch for vehicle infotainment and telematics subsystems
    Diodes Incorporated has launched the AP22653Q programmable current limiting power switch, it said in a press release on 31 August. The devices help streamline power system design and provides a controlled and protected power path. Key applications include protection of vehicle USB ports and ECU supp...
    01-Sep-2021 News New Products
    Maruti Suzuki's production hit due to semiconductor chip shortage in India
    According to a CNBC press release dated 31 August, India's largest carmaker Maruti Suzuki warned on Tuesday that vehicle production in September will drop by 60% due to a chip shortage, joining a slew of global automakers facing a pandemic-led scarcity of critical components. The company, which h...
    Renesas completes USD5.6 billion acquisition of Dialog Semiconductor
    Renesas Electronics Corporation and Dialog Semiconductor announced the successful completion of Renesas' acquisition of the entire issued and to be issued share capital of Dialog in an official press release dated 31 August. Renesas will fund the cash consideration payable to Dialog shareholders of ...
    Stellantis to halt production at Sevel, Italy plant over chip shortage
    According to an ETAuto press release dated August 27, production at a Stellantis plant in Italy producing light commercial vehicles will be halted next week due to a semiconductor shortage, a carmaker spokesperson said on Friday, confirming a trade union statement. "I can confirm production at th...
    Murata Manufacturing commercializes broadband inductors for automotive PoC applications
    Murata Manufacturing has commercialised the broadband inductor for Bias-T circuits for use with vehicle-mounted PoC (Power Over Coax)LQW43FT 0H Series, according to an official press release dated August 24. The mass production phase is set to begin in September 2021. Murata's original ceramic ma...
    AutoTechInsight Weekly – 30 August 2021
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