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Is the automotive industry facing another chip crisis? Nexperia's control shift raises questions
On Oct. 13, the Dutch government took control of Nexperia, a semiconductor manufacturer owned by mainland China's Wingtech.. This intervention aims to safeguard critical technological capabilities in the Netherlands and Europe, as approximately 80% of Nexperia's production capacity is based in mainland China, raising alarms about potential supply chain disruptions in the automotive industry. Who is exposed? While German original equipment manufacturers have been the first to raise the alar...
Dutch move on Nexperia triggers nervousness among auto suppliers and OEMs
On Monday, Oct. 13, the Dutch government took a decisive step to assume control of Nexperia, the Nijmegen-based semiconductor manufacturer owned by mainland China’s Wingtech. Officials described the intervention as “highly exceptional,” citing governance shortcomings, national security risks and the need to safeguard critical technological capabilities for the Netherlands and Europe. Nexperia, headquartered in Nijmegen, the Netherlands, has been owned by Wingtech since 2018. Wingtech is...
Schaeffler secures contract to supply dual inverter for electrified pickup trucks in North America
Schaeffler has secured an order from a vehicle manufacturer in North America to supply dual inverters for its new plug-in hybrid platform, which will debut in a new pickup truck. This advanced technology will control the electric drive for auxiliary units and serve as a traction inverter, powering an electric drive motor with an output exceeding 200 kW. The dual inverter is specifically designed for electrified pickup trucks, a popular vehicle type in North America. Consequently, this order m...
Micron Technology ships automotive UFS 4.1 solution for faster connected driving experiences
Micron Technology announced that it has begun shipping qualification samples of its automotive-grade Universal Flash Storage (UFS) 4.1 solution to customers worldwide. The new storage platform delivers rapid data access, advanced reliability, and enhanced safety and security features for next-generation intelligent vehicles. With a bandwidth of 4.2 GB/s — twice that of the prior generation — Micron’s automotive UFS 4.1 accelerates AI workloads, powering in-cabin capabilities such as voice ...
BorgWarner secures additional projects to supply dual inverters to Great Wall Motor
BorgWarner is deepening its collaboration with Chinese automaker Great Wall Motor (GWM) in the field of electrified propulsion, expanding on two dual-inverter programs to include two additional projects. The company plans to begin mass production of its new dual inverters for GWM in 2026. Stefan Demmerle, vice president of BorgWarner Inc. and president and general manager of PowerDrive Systems, highlighted BorgWarner's technical expertise in electrification and dual-inverter products as ...
Mercedes-Benz opens its first R&D facility in Kecskemét city, Hungary
German luxury-car maker Mercedes-Benz is investing €55 million in establishing its first research and development center in Hungary. Péter Szijjártó, minister of Foreign Affairs and Trade, government of Hungary, announced that Mercedes-Benz's investment in the city of Kecskemét will include early hardware and software development, with prototype testing to soon begin. The technologies developed at the newly opened R&D center will be used in new electric p...
Microchip Technology introduces LAN866x devices for zonal architectures in automotive networking
Microchip Technology has introduced the LAN866x family of 10BASE-T1S end point devices featuring remote control protocol (RCP) for zonal architectures in automotive networking. With its offerings, the company aims to address the challenges in the automotive industry's shift to zonal architectures for in-vehicle networking. These devices aim to simplify network integration by extending Ethernet connectivity to the edges of in-vehicle networks, facilitating the creation of software-defined vehicle...
STMicroelectronics introduces VNF1248F for enhanced automotive e-fuse safety and power efficiency
STMicroelectronics has unveiled the VNF1248F, a new addition to its Sti2Fuse family, which is an automotive e-fuse metal-oxide-semiconductor field-effect transistor (MOSFET) controller designed for enhanced protection, power efficiency and safety in modern vehicles. The VNF1248F offers a rapid response time of 100 microseconds, surpassing traditional wire fuses, to prevent fault propagation within vehicle electrical systems. It supports multiple boardnet voltages, including 12 V, 24 V and 4...
Molex debuts eHV60 connector for battery-electric vehicles and PHEVs in high-voltage systems
Molex has launched the first product in its eHV high-voltage connector and terminal system portfolio designed for high-performance electrical connections in battery-electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The initial offering is the eHV60 High-Voltage Automotive Connector, which is suitable for auxiliary high-voltage functions such as DC/DC converters, onboard chargers, electric compressors and e-axles. The eHV60 provides a compact and efficient solution to increas...
Foresight partners with Chinese manufacturer for AI-based solutions in India and South Korea
Foresight Autonomous has announced a strategic commercial cooperation agreement with a prominent Chinese manufacturer specializing in AI-based stereo vision solutions. According to the agreement, Foresight will integrate the manufacturer's 3D perception systems into its product offerings, targeting exclusive commercialization in India and South Korea, with plans for further global market distribution. The collaboration aims to enhance Foresight's product range, initially focusing on the advanced...
Hesai Technology partners with Li Auto for next-generation lidar supply
Hesai Technology has been selected by Li Auto to supply lidars for its next-generation assisted driving platform, which includes the L Series, i Series and MEGA. Li Auto designs, develops, manufactures and sells smart electric vehicles, having delivered over 1.46 million vehicles as of Oct. 31. Lidars have been a standard feature in all new Li Auto models since May. Since 2021, Hesai and Li Auto have maintained a close partnership focused on collaboration and innovation. This cooperation...
Stradvision partners with AMD to enhance autonomous driving technology
Stradvision has announced a multiyear collaboration with AMD to advance perception technology in autonomous driving. At Consumer Electronics Show (CES) 2026, the companies will demonstrate Stradvision's MultiVision software running on the AMD Versal AI Edge Series Gen 2 VEK385 Evaluation Kit, showcasing multicamera perception capabilities in next-generation vehicles.  The partnership integrates Stradvision's SVNet and MultiVision software with AMD's automotive system-on-chips (...
GlobalFoundries partners with TSMC to advance gallium nitride technology for diverse applications
GlobalFoundries (GF) has announced a technology licensing agreement with TSMC for 650-V and 80-V gallium nitride (GaN) technology. This strategic move is intended to accelerate GF's development of next-generation GaN products for applications in data centers and automotive power systems, thereby providing US-based GaN capacity for a global clientele. As traditional silicon complementary metal-oxide-semiconductor (CMOS) technologies approach their performance limits, GaN is being recogniz...
China exempts export controls on Nexperia chips for civilian use
China has announced exemptions to export controls on Nexperia chips intended for civilian use, according to its Ministry of Commerce. This decision is expected to help relieve supply constraints in the automotive sector. This move indicates an easing of restrictions impacting the global auto industry, following the Dutch government's control over Nexperia, a significant producer of automotive electrical system chips. Nexperia, based in the Netherlands, is owned by Wingtech, a Chinese compan...
AutoTechInsight Weekly - 10 November 2025
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Ams OSRAM launches advanced 5-junction laser for enhanced lidar systems
Ams OSRAM has introduced a new 5-junction edge-emitting laser that enhances these systems significantly. This new laser provides higher optical peak power while using less electrical current compared to the previous 3-junction technology, which already extended the range by 50%. By employing five vertically stacked emitter layers, the 5-junction laser further extends the range and improves energy efficiency, reducing heat generation and simplifying thermal design. For developers, the laser's ...
Tesla explores building large semiconductor fabrication facility for AI chips with potential Intel collaboration
Tesla CEO Elon Musk announced plans for potentially building a large semiconductor fabrication facility for artificial intelligence chips. At the company's annual meeting, Musk discussed Tesla's fifth-generation AI chip, which is intended to advance their autonomous technology, and suggested the possibility of collaboration with Intel, though no agreement has been finalized. As Intel faces challenges in the AI chip market against competitors like Nvidia, the US government recently acquired a 10%...
AEye expands growth strategy with LITEON partnership and institutional investment
AEye announced an acceleration of its growth strategy through expanded manufacturing with LITEON Technology and a strategic investment from an institutional investor. This strategy will enhance AEye's capital-light model, enabling the rapid scaling of Apollo production to meet increasing global demand while maintaining efficiency and financial discipline. LITEON, specializing in optoelectronics and power management, is establishing a dedicated manufacturing line for Apollo lidar units. This c...
Marelli opens new technical R&D center in India to enhance automotive technology capabilities
Marelli has launched a new technical research and development (R&D) center in Bengaluru, Karnataka, India, as part of its effort to expand its engineering capabilities and bolster its innovation strategy in key automotive technology areas. The facility, which officially opened on Nov. 5, will employ 350 engineers. Located in the Embassy Manyata Tech Park, the new site joins another Marelli R&D center in Bengaluru, opened in 2022, benefiting from the region's rich talent pool...
TriLite unveils Trixel three Cube for AR and automotive applications
TriLite has announced the Trixel 3 Cube, an addition to its laser beam scanner (LBS) display technology platform, designed for augmented reality and automotive applications. The Cube signifies an advancement in miniaturization and system efficiency, integrating TriLite's optical architecture into a compact form with power optimization for easy integration into AR eyewear and automotive displays. It is currently available as an engineering sample, with mass production expected to support customer...
Volkswagen develops first self-designed SoC in mainland China
Volkswagen Group China announced the development of its first self-designed System-on-Chip (SoC) in mainland China. This chip, developed locally through CARIZON, a joint venture between CARIAD and Chinese technology company Horizon Robotics, is intended for the next generation of smart, connected cars in China. It will power Volkswagen's advanced driver assistance systems (ADAS) and automated driving functions, processing data from cameras and sensors to enhance driving safety and intelligence. ...
Novosense launches advanced LED driver ICs for automotive lighting applications
Novosense Microelectronics, an automotive analog company based in mainland China, announced the release of its new range of high-performance LED driver ICs—NSL21912, NSL23716x and NSL2163x—designed for both exterior and interior vehicle lighting. These innovations consist of high-side and low-side linear drivers and integrated microcontroller (MCU) solutions for ambient RGB and RGB control, offering precise current regulation, advanced diagnostics, and robust thermal management. This allows ...
STMicroelectronics launches eight-channel gate driver for 48V automotive systems
STMicroelectronics has unveiled the L98GD8, an eight-channel gate driver tailored for 48V automotive power systems, supporting the move towards mild-hybrid vehicles and increased electrical efficiency. Operating from a 58V supply, it features configurable channels for MOSFET control in various configurations, including high-side and low-side switches and H-bridges for DC motor applications. The device also supports peak-and-hold control for electrically operated valves. The 48V powernet archi...
Mainland China opens first state-level testing platform for automotive chips in Shenzhen
Mainland China has opened its first state-level testing platform for automotive chips in Shenzhen, as reported by the South China Morning Post. This facility aims to verify car-chip standards and is part of China's broader effort toward technological self-sufficiency. The platform was established through the collaboration of two state-owned enterprises: China Reform Holdings and the China Automotive Technology and Research Center. Equipped with over 80 sets of testing instruments and 13 ...
Infineon expands MOTIX motor control SoC family with TLE994x and TLE995x series
Infineon Technologies AG is expanding its MOTIX 32-bit motor control system-on-chip (SoC) family with the introduction of two new products — TLE994x and TLE995x — designed for both brushed (BDC) and brushless (BLDC) motor applications. These new solutions cater to small to medium-sized automotive motors, with applications ranging from battery cooling systems in electric vehicles to comfort features such as seat adjustments. As the number of motors in modern vehicles, especially electric o...
Magnachip and Hyundai Mobis expand IGBT collaboration for future EV inverters
Magnachip Semiconductor has announced an agreement with Hyundai Mobis Co. Ltd. concerning the use of high-performance insulated-gate bipolar transistor (IGBT) technology. Hyundai Mobis, a global provider of auto parts focusing on differentiated mobility solutions, has been collaborating with Magnachip since 2015 on developing IGBTs for traction inverters targeted at hybrid and electric vehicles. Recognizing the importance of internalizing core power semiconductor technologies for traction system...
ZF Group partners with Horizon Robotics for ADAS in China
ZF Group has announced a collaboration with Horizon Robotics to introduce an advanced driver assistance system for the Chinese market, capable of supporting up to SAE Level 3 assisted driving, alongside China's urban Navigate on Autopilot (NOA). This system is set to be implemented in the electric vehicle platform of a Chinese automobile brand, with mass production and delivery planned for 2026. This venture marks a significant stride in ZF's localization strategy in China, particularly in ...
Geely integrates Arm's Automotive Enhanced technologies and compute platform on new EX5
The new Geely EX5, set to launch in the UK, serves as a testament to how Arm technology seamlessly combines performance, safety and connectivity on a single platform. The SiEngine StarEagle (SE1000) system-on-chip (SoC), at the core of the EX5, is built on Arm's Automotive Enhanced technologies, showing the benefits of close silicon partnerships in automotive innovation. This SoC houses Arm Cortex-A CPUs for application processing, Arm Cortex-R CPUs for real-time control, Arm Mali GPUs for high-...
Nexperia welcomes announcements lifting block on chip shipments
Dutch chipmaker Nexperia BV said it welcomes recent announcements by the US and Chinese governments lifting restrictions on the shipment of its chips, marking a potential turning point in the global supply disruption that has alarmed automakers, Reuters reported Nov. 2. The company emphasized that its priority is now ensuring supply stability for customers. The Dutch government, which recently took control of Nexperia citing national security reasons, stated it continues discussions with Chin...
Magna reports net sales at $10.5B in Q3, up 2% YoY
Magna International Inc. reported its financial results for the third quarter ended Sept. 30, with sales reaching $10.5 billion, a 2% increase from the same period in 2024, according to an Oct. 31 earnings release. The rise in sales was driven by new program launches, a favorable foreign exchange rate shift against the US dollar, and a 3% increase in global light vehicle production. However, these gains were partly offset by the conclusion of certain production programs, reduced vehicle assem...
DENSO’s H1 FY 2025/26 revenue up 3.3% year over year to $24.1 billion
DENSO Corp. reported a 3.3% year-over-year increase in consolidated net sales to ¥3.6 trillion (about $24.1 billion) in the first half of the current financial year ended Sept. 30, 2025. Despite higher sales, the company recorded a 15.8% year-over-year drop in operating profit to ¥211.4 billion, while net profit attributable to owners of the parent company fell 31.2% to ¥131.4 billion.  The leading Japanese supplier attributed increased revenue to higher vehicle sales in North Am...
Lear's Q3 2025 net sales up 1.7% year over year to $5.7 billion
Lear reported a 1.7% year-over-year increase in net sales to $5.7 billion in the third quarter ended Sept. 30, 2025. Despite higher sales, the US-based supplier recorded a 6.2% year-over-year decline in core operating earnings to $241 million, while net income fell 20.6% year over year to $108 million. Lear attributed lower earnings to production disruptions at JLR and lower volumes on some of its platforms. The company recorded operating cash flow of $444 million and fr...
AutoTechInsight Weekly - 3 November 2025
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Infineon opens UWB application lab in Graz with Silicon Austria Labs collaboration
Infineon Technologies has established a dedicated Ultra-Wideband (UWB) Application Lab in Graz, Austria, in collaboration with Silicon Austria Labs (SAL). This lab focuses on advancing UWB technology by exploring use cases and delivering real-world applications for the automotive and other markets. The UWB lab aims to accelerate innovation and customer value by integrating cutting-edge research with practical testing, serving as a hub for collaboration with international customers, research inst...
NXP releases battery management chipset with EIS integration for EV safety
NXP Semiconductors has announced the release of its Electrochemical Impedance Spectroscopy (EIS) battery management chipset, marking a significant advancement in battery management technology. The chipset features hardware-based nanosecond-level synchronization across all devices, designed to enhance the safety, longevity and performance of electric vehicles and energy storage systems. By integrating EIS measurements directly into three battery management system (BMS) chipset units, NXP enables ...
Stellantis creates "war room" to address potential chip shortages
According to a report Reuters published on Oct. 31, Stellantis has established a “war room” to manage potential chip shortages occurring from complications at Dutch group Nexperia. During a call with analysts about the company's third-quarter performance, CEO Antonio Filosa responded to a question about whether Stellantis could face production stoppages similar to those at Volkswagen, emphasizing that Stellantis is actively monitoring the chip situation related to Nexperia and implementing a...
Lumax Auto Technologies opens technology center in Bengaluru, India
Lumax Auto Technologies Ltd. (LATL), a tier 1 supplier to Indian automotive manufacturers, launched its new Technology Center in Bengaluru, India, on Oct. 30. Named the Smart Hub for Innovation and Future Trends (SHIFT), this research and development center is designed to enhance electronics engineering and digital capabilities for software-defined vehicles (SDVs). It will focus on R&D in areas such as in-cabin experiences, advanced driver assistance systems, connectivity and embe...
Niron Magnetics partners with Greater St. Cloud Development Corp. to advance its planned Sartell facility in Minnesota, US
Niron Magnetics has announced a partnership with the Greater St. Cloud Development Corp. (GSDC) to emphasize the regional economic impact of its new project — a 190,000-square-foot permanent magnet manufacturing facility in the Sartell city, Minnesota, US. The collaboration builds on previous efforts between the two organizations, which involved creating an incentive package and a development plan, as well as setting job creation targets to establish Niron Magnetics' Plant 1 in Sartell. Wor...
GlobalFoundries invests €1.1 billion to expand Dresden manufacturing under European Chips Act
GlobalFoundries has announced a €1.1 billion investment to expand its manufacturing capabilities at its Dresden, Germany, site. This project, known as SPRINT, aims to increase production capacity to over one million wafers per year by the end of 2028, positioning it as the largest site of its kind in Europe. This expansion will be supported by the German federal government and the State of Saxony under the European Chips Act, with full EU program approval expected later this year. The investme...
US and Japan sign agreement to secure rare earth supply chains
The United States and Japan have signed a framework agreement to secure the supply of rare earths and critical minerals, aiming to reduce dependence on mainland China's dominant role in the global market. This agreement was signed by US President Donald Trump and Japanese Prime Minister Sanae Takaichi during Trump's visit to Tokyo, which was part of his weeklong tour of Asia. The document outlines cooperation in extraction, recycling, stockpiling and investment in mineral supply chains crucia...
Uber partners with NVIDIA to enhance autonomous fleets with AI architecture
Uber Technologies Inc. announced a collaboration with NVIDIA to enhance the next generation of robo-taxi and autonomous delivery fleets using NVIDIA AI Architecture, according to the Oct. 28 news release. The partnership aims to significantly expand Uber's global autonomous fleets. Stellantis will contribute by delivering at least 5,000 NVIDIA-DRIVE-powered Level 4 (L4) autonomous vehicles to Uber for robo-taxi operations both in the US and internationally. These vehicles will be developed wi...
NXP acquires Aviva Links and Kinara to advance automotive connectivity and AI-powered edge systems
NXP Semiconductors NV has completed its previously announced acquisitions of Aviva Links and Kinara, strengthening its automotive networking and edge AI portfolios. Acquisition of Aviva Links was finalized Oct. 24 via a $243 million cash purchase. Aviva Links is a key supplier of Automotive SerDes Alliance (ASA)-compliant high-speed in-vehicle connectivity solutions. The addition of Aviva Links expands NXP’s automotive networking capabilities across automotive and industrial/internet...
Volkswagen and Bosch sound alarm as Nexperia dispute threatens Europe’s auto supply chain
Europe's automotive industry is bracing for disruptions after a diplomatic and trade dispute over Dutch chipmaker Nexperia escalated, prompting urgent calls from automakers and suppliers for political intervention to avert production halts. The standoff began after the Dutch government placed Nexperia—owned by China's Wingtech Technology- under state control, citing national-security and intellectual-property concerns. In response, Beijing blocked exports of Nexperia's chips from its facili...
ROHM introduces RBE01VYM6AFH diode for high-resolution ADAS camera protection
ROHM has developed a Schottky barrier diode, dubbed the RBE01VYM6AFH, which overcomes the traditional forward voltage drop/reverse current (VF/IR) trade-off, providing high reliability protection for high-resolution image sensor applications such as advanced driver assistance systems (ADAS) cameras, according to an Oct. 23 news release. The need for greater precision in modern ADAS cameras necessitates higher pixel counts, leading to concerns about damage from photovoltaic voltage generated d...
Sony unveils IMX828 with integrated MIPI A-PHY interface for automotive applications
Sony Semiconductor Solutions Corp. announced the upcoming IMX828, which is noted as the first in the industry to feature a CMOS image sensor for automotive applications with an integrated MIPI A-PHY interface, according to a news release. This enables the elimination of externally mounted serializer chips, resulting in a more compact, energy-efficient and thermally streamlined camera system. The IMX828 also boasts an 8-effective-megapixel resolution and the highest level of high dynamic range...
NXP Semiconductors launches i.MX 952 processor for AI-powered automotive applications
NXP Semiconductors announced the i.MX 952 applications processor, part of its i.MX 9 series, designed for AI-powered vision, human-machine interfaces, and in-cabin sensing applications. The processor utilizes sensor fusion with the eIQ Neutron Neural Processing Unit to deliver capabilities like driver monitoring and child presence detection. The i.MX 952 features pin-to-pin compatibility with the i.MX 95 family, allowing developers to scale their designs across different price points efficien...
Harman to invest nearly $42M to expand automotive electronics manufacturing at Pune facility
Samsung Electronics Co. Ltd. subsidiary Harman announced a new investment of 3.45 billion Indian rupees ($42 million) to expand its automotive electronics manufacturing facility in Chakan, Pune, India. The plan involves an investment of 450 million rupees ($5.5 million) and an additional 3.0 billion rupees ($36.5 million) over the next three years to enhance advanced telematics and next-generation automotive connectivity programs. This brings Harman's total investment in the Pu...
GM to introduce centralized vehicle computing platform in 2028
General Motors (GM) is set to introduce a centralized vehicle computing platform and next-generation electrical architecture across electric and gas-powered vehicles, starting with the Cadillac Escalade IQ in 2028. This new design reflects a significant transformation in the construction and potential updates of GM vehicles over time. More than 4.5 million GM vehicles can receive over-the-air (OTA) system updates, with this capability expanding by approximately 2 million vehicles annually. In 20...
US auto industry faces production risks amid Nexperia chip dispute
US auto manufacturers could face major production disruptions within two to four weeks as tensions escalate between China and the West over chipmaker Nexperia, according to the Motor & Equipment Manufacturers Association (MEMA), the largest vehicle supplier group in the United States. Beijing recently prohibited Nexperia — a key supplier of semiconductors for the automotive and consumer electronics sectors — from exporting chips produced at its Chinese facilities. The move came after ...
iDEAL Semiconductor's SuperQ technology achieves AEC-Q101 automotive qualification
iDEAL Semiconductor has announced that its SuperQ technology has achieved AEC-Q101 automotive qualification, indicating a significant expansion into high-reliability markets. The first automotive-qualified product from iDEAL, the iS20M028S1CQ, is a 200 V MOSFET featuring 25 mΩ RDSon and a temperature rating of 175°C. SuperQ technology represents a major advancement in silicon MOSFETs, offering superior efficiency, reduced switching losses, and improved conduction while maintaining silicon's na...
AutoTechInsight Weekly - 27 October 2025
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Volkswagen faces potential production halts amid Nexperia chip dispute and supply chain issues
Volkswagen has warned its workers of potential production stoppages due to ongoing supply chain issues, following a dispute involving Dutch chipmaker Nexperia. The Dutch government took control of Nexperia, which is owned by China, citing intellectual property concerns, while China has placed restrictions on exporting necessary products to European car manufacturers. Although Volkswagen has not yet been directly affected by chip shortages, it acknowledged the possibility of future impacts on pro...
Nexperia alerts Japanese auto-parts makers of potential chip supply disruptions
Nexperia has informed Japanese auto-parts manufacturers that it may be unable to ensure stable chip supplies, according to the Japan Automobile Manufacturers Association (JAMA), The Japan Times reported Oct. 23. JAMA said on Thursday (Oct. 23) that Nexperia’s semiconductors are essential components in vehicle electronic control units, and any disruption in their supply could severely affect global automobile production. The association expressed hope that the nations involved will find a sw...
Forvia Hella’s nine-month sales remain stable amid challenging business environment
Forvia Hella’s sales in the first nine months of 2025 remained stable at €5.9 billion. However, the company’s sales, on constant currency, improved slightly, by 0.4% year over year, to €6 billion. “In the first nine months of the year, our business continued to prove robust. Despite a persistently challenging industry environment, we were able to keep sales at the previous year’s level and are thus in line with our expectations,” said Bernard Schäferbarthold, CEO of Forvia Hella. ...
Forvia's Q3 2025 sales decline 3.7% year over year to €6.1 billion
Forvia’s sales declined 3.7% year over year to €6.1 billion in the third quarter ended Sept. 30, 2025. Excluding tooling sales, product sales increased by 1% on an organic basis. The third-quarter sales included negative currency effects of €238 million, mainly resulting from the euro’s depreciation against the US dollar and Chinese yuan. Growth in product sales was led by strong performance by Electronics, Clean Mobility and Lifecycle business groups. Sales increased in the Elec...
Ecarx collaborates with Victory Giant Technology to develop automotive computing platforms
Mobility technology company Ecarx announced a strategic partnership with Victory Giant Technology (VGT), renowned for its expertise in printed circuit boards (PCBs). The collaboration aims to develop advanced computing platforms for the automotive sector. VGT is known for its high-density interconnect (HDI) and high-layer-count PCBs, which are crucial in automotive intelligence, AI and data center applications. Operating manufacturing sites in Vietnam, Malaysia and Thailand, VGT serves over 350 ...
Volkswagen to halt Golf production in Germany amid looming chip supply shortage
Volkswagen will pause the production of the Golf at its Wolfsburg plant in Germany starting Oct. 29 as a result of a new microchip crisis triggered by a trade dispute between the US and China. This announcement follows an internal alert from Volkswagen to its workers about possible production disruptions. Besides the Golf, other models such as the Tiguan, Touran and Tayron, also manufactured at the Wolfsburg facility, are expected to experience production halts, although the duration of the...
Tata Technologies collaborates with Synopsys to accelerate software-defined vehicle innovation
Tata Technologies has announced a strategic collaboration with Synopsys to accelerate the development of software-defined vehicles (SDVs). The partnership will focus on the early and expedited verification and validation of electronic systems, aiming to address the complexities inherent in next-generation mobility. Tata Technologies will contribute its deep domain expertise in vehicle engineering, while Synopsys will offer its virtualization solutions for deploying electronics digital twins, cre...
Aptiv introduces Gen 8 radars to power next-generation ADAS applications
Aptiv has introduced its latest radar technology designed to meet the evolving demands of future advanced driver assistance systems. The new Gen 8 radars, powered by Aptiv’s proprietary antenna and silicon design, provide superior performance and high-resolution sensing, which are essential for advanced AI and machine learning capabilities in vehicles. The Gen 8 radars enable hands-free driving in complex urban environments, enhancing vehicle perception with greater cost efficiency. The fro...
Geely deploys Raytron's automotive thermal camera on LEVC L380 to reduce night collisions
Geely’s new premium electric multipurpose vehicle, the LEVC L380, features an Infrared Night Vision System (NVS) developed by Raytron to improve visibility in low-light and nighttime conditions. The system uses a thermal imaging camera to help detect pedestrians and obstacles in darkness, fog, or glare, where conventional cameras may be less effective. It is part of the vehicle’s suite of 28 perception sensors, aimed at enhancing overall driving safety. According to the National Highway Traf...
ACEA calls for quick resolution to critical chip supply shortage
The European Automobile Manufacturers' Association (ACEA) has expressed deep concern over potential major disruptions in European vehicle manufacturing due to an interruption in the supply of Nexperia chips. On Oct. 10, automobile manufacturers and their suppliers were informed by Nexperia that they could no longer guarantee the delivery of their chips to the automotive supply chain. Nexperia supplies a significant volume of semiconductors crucial for electronic control units in vehicle electric...
AutoTechInsight Weekly - 20 October 2025
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Infineon unveils first gallium nitride transistor family for automotive applications
Infineon Technologies unveiled its first gallium nitride (GaN) transistor family qualified to the Automotive Electronics Council (AEC) standard for automotive applications. The company has begun supplying samples of the CoolGaN Automotive Transistor 100 V G1 family, which adheres to AEC-Q101 standards and includes high-voltage CoolGaN Automotive Transistors and bidirectional switches. These innovations cater to the increasing demand for efficient power conversion solutions in automotive fe...
DENSO to showcase future mobility technologies at Japan Mobility Show 2025
DENSO Corp. will participate in the Japan Mobility Show 2025 at Tokyo Big Sight from Oct. 30 to Nov. 9. The theme of DENSO's exhibit will focus on technologies that enhance societal value through advancements in automobiles and connectivity with urban environments. The exhibition will include a four-seater simulation vehicle, an immersive theatre and presentations that feature videos and real products. DENSO highlights the future of transportation with the introduction of software-defined ...
ChipSync and Cortus collaborate to offer tailored SDV solutions in India
ChipSync and Cortus are collaborating to develop electronic automotive and consumer solutions for the Indian market. ChipSync is an innovator in connected car technology in India, while Cortus specializes in reduced instruction set computing, version 5 (RISC-V) chips and AI inference chiplets. The partnership focuses on integrating Cortus' RISC-V automotive chips and AI chiplets with ChipSync's connected car software solutions, aiming to advance automotive and software-defined vehicle techn...
Novosense, UAES and Innoscience form alliance to advance power electronics in new-energy vehicles
Novosense Microelectronics, United Automotive Electronic Systems (UAES) and Innoscience have entered into a strategic alliance to advance power electronics in new-energy vehicles (NEVs). The collaboration will focus on developing intelligent integrated gallium nitride (GaN) products to enhance GaN driving and protection features, thereby supporting higher power density and facilitating wider application in automotive systems. GaN, known for its superior material properties compared to traditi...
GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, Tier IV join Imec Automotive Chiplet Program
Imec announced that GlobalFoundries has joined its Automotive Chiplet Program (ACP) as a foundry partner. Alongside GlobalFoundries, semiconductor and system companies such as Infineon, Silicon Box, STATS ChipPAC and Japanese autonomous driving technology developer Tier IV have also committed to the ACP. This expansion aims to enhance Imec's network and accelerate the development and adoption of advanced chiplet architecture tailored for the automotive industry's specific requirements. With t...
Renesas Electronics considers selling $2 billion Timing division amid industry interest
Renesas Electronics Corp. is considering selling its Timing division, a move that could see the unit valued at nearly $2 billion. The Japanese semiconductor firm has engaged JPMorgan to explore this potential divestment, which is in its preliminary stages. There is expected interest from major players in the chip industry, such as Texas Instruments from the US and Germany's Infineon.  Renesas' Timing division specializes in integrated circuits responsible for managing clock, timing and s...
Dutch government takes control of Nexperia amid governance and security concerns
The Dutch Department of Economic Affairs has assumed control of semiconductor manufacturer Nexperia due to concerns about the transfer of crucial technological knowledge to its Chinese parent company, Wingtech, according to an Oct. 14 report by Cybernews. The intervention was prompted by signals indicating serious governance shortcomings within Nexperia, which posed a threat to the technological capabilities and economic security of both the Netherlands and Europe. The Goods Availability Act was...
Keysight unveils AE6980T optical automotive Ethernet test solution at IEEE event in France
Keysight Technologies has introduced the AE6980T nGBASE-AU Optical Automotive Ethernet Transmitter Test Solution, the first platform designed to qualify next-generation optical automotive Ethernet PHYs that align with the IEEE 802.3cz standard. This unveiling took place at the 2025 IEEE SA Ethernet & IP at Automotive Technology Day held in Toulouse, France. The IEEE 802.3cz standard pertains to multigigabit optical automotive Ethernet ranging from 2.5 G to 50 G over multimode fiber, offering...
DENSO launches innovative products to enhance EV efficiency
DENSO has announced the development of new electrification products aimed at improving energy efficiency, driving performance and reducing charging times for electric vehicles. These innovations are designed to enhance the practicality of EVs and include an inverter to be featured in the new e-axle from BluE Nexus Corp., as well as a cell supervising circuit for measuring battery voltage and temperature, and a shunt current sensor for measuring current. These products will specifically be instal...
AutoTechInsight Weekly - 13 October 2025
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Zeekr launches updated 001 with ultrafast charging, improved powertrain
Mainland Chinese electric-vehicle maker Zeekr has officially launched the updated Zeekr 001 shooting brake, showcasing significant specification upgrades while maintaining its exterior design. The updated model features an official starting price of 269,800 yuan (about $37,826), up from the predecessor's 259,000 yuan. With a limited-time trade-in subsidy of 10,000 yuan, the effective starting price becomes 259,800 yuan. The 2026 Zeekr 001 is developed on a 900-V high-voltage architecture, ...
Ferrari announces details of its first all-electric car Elettrica
Ferrari unveiled its first all-electric car, the Ferrari Elettrica, during Capital Markets Day 2025. This marks a significant milestone in Ferrari's multi-energy strategy, which includes internal combustion engines (ICEs), hybrid electric vehicle (HEV) and plug-in hybrid electric vehicle powertrains, and now fully electric drive. The Ferrari Elettrica combines advanced technology and performance while maintaining Ferrari's traditional engineering and craftsmanship. The chassis and bodysh...
China rolls out stricter export restrictions for rare earth
China has enforced stricter export controls on rare earth elements and other critical materials necessary for advanced technology manufacturing, as trade negotiations with the US continue. China processes approximately 90% of the world's rare earths, which are utilized in various products such as solar panels and smartphones. This strategic move comes ahead of an expected meeting between Chinese leader, President Xi Jinping, and US President Donald Trump. Beijing had previously restricted ...
Autoliv, HSAE agree to form JV for automotive safety electronics in mainland China
Autoliv plans to establish a joint venture with Hangsheng Electric Co. Ltd. (HSAE), a company specializing in automotive electronics, to jointly develop and produce advanced safety electronics tailored to the evolving automotive market in mainland China. The JV is expected to be formally established in the first quarter of 2026, contingent upon receiving regulatory approvals from mainland Chinese authorities. HSAE will have a majority stake of 60% in the JV, with Autoliv owning the remaining 40%...
Microchip and AVIVA Links achieve Automotive SerDes Alliance Motion Link interoperability
Microchip Technology and AVIVA Links have achieved the Automotive SerDes Alliance Motion Link (ASA-ML) interoperability milestone, marking a shift toward open standards in automotive connectivity. In October, AVIVA Links announced its acquisition by NXP Semiconductors, reflecting industry support for ASA-ML standards. ASA-ML is being increasingly adopted by original equipment manufacturers and tier 1 suppliers for in-vehicle networking due to its high-speed communication capabilities for cameras...
STMicroelectronics unveils L98GD8 driver for 48-V automotive systems with advanced features
STMicroelectronics has introduced the L98GD8 driver, designed for 48-V automotive power systems, featuring eight configurable channels for driving metal-oxide-semiconductor field-effect transistors (MOSFETs) in various configurations. This driver can operate from a 58-V supply, offering diagnostics and protection to enhance safety and reliability. The 48-V powernet is beneficial for car manufacturers aiming to improve mild-hybrid systems by supporting integrated starter-generators (ISGs), enhanc...
Sumitomo Riko adopts Ansys' AI to enhance automotive component design and manufacturing
Sumitomo Riko is integrating Ansys' AI technology to enhance efficiency in the design and manufacturing of automotive components. SimAI, which analyzes both new and legacy simulation data, is being used to create AI models that can quickly predict performance. The deployment of SimAI helps Sumitomo Riko accelerate complex computational tasks such as anti-vibration design, battery cooling, magnetic field analysis and mixing heat transfer analysis. As a global manufacturer of high-per...
Diodes introduces PI7C9X762Q automotive-compliant UART bridge for EV design
Diodes Inc. has introduced the PI7C9X762Q, a high-performance automotive-compliant inter-integrated circuit/serial peripheral interface (I2C/SPI-bus-to-dual-channel) universal asynchronous receiver-transmitter (UART) bridge, designed to meet the needs of electric vehicle designs. The device is particularly suitable for smart cockpits, central controllers, input/output (I/O) module controllers, advanced driver assistance systems, telematics and zonal gateways due to its low-po...
Omnivision unveils 5-MP sensor for in-cabin monitoring with Nyxel technology
Omnivision has introduced the OX05C, the first 5-megapixel (MP) back-side illuminated global shutter high-dynamic range sensor designed for in-cabin driver and occupant monitoring systems. This new sensor, part of its Nyxel near-infrared technology family, will be demonstrated at AutoSens Europe in Barcelona, Spain. The OX05C offers high-quality imaging with a pixel size of 2.2 micrometers (µm) and utilizes Nyxel technology for enhanced low-light performance at the 940-nanometer near in...
Vishay expands inductor and frequency control product lines with over 2,000 new SKUs
Vishay Intertechnology has announced the successful expansion of its inductor and frequency control device product lines, which were initially announced in September 2024. This expansion has led to the release of over 2,000 new stock-keeping units (SKUs) across nearly 100 series, with more rollouts planned for 2025. The expanded product offerings improve sourcing options for customers, offering broader inductance and voltage ranges, enhanced noise suppression, and additional size variations suit...
Bosch integrates NVIDIA DRIVE AGX Thor into vehicle platforms for AI-driven advancements
Bosch has initiated a strategic integration of the NVIDIA DRIVE AGX Thor platform into its upcoming compute and electronic control unit (ECU) architectures. This collaboration aims to advance Bosch's provision of AI-driven solutions for software-defined vehicles (SDVs), reflecting the rising trend among automakers toward centralized computing platforms that can manage both safety-critical tasks and AI workloads. Industry analysts predict that by 2030, over half of new vehicles sold will adopt...
Mainland Chinese automakers’ tie-ups with Huawei to speed up smart EV launches
Mainland China’s state-run automakers have pinned hopes on their partnerships with Huawei to gain a solid foothold in the country’s highly competitive electric vehicle (EV) market. Under Huawei-backed Harmony Intelligent Mobility Alliance (HIMA), mainland Chinese automakers have introduced a diverse range of EVs featuring Huawei’s smart vehicle technologies over the past three years. In late September, SAIC became the fifth automaker to join the auto alliance, following the footsteps of Se...
Betamek collaborates with Jiangsu Yibang to advance EV charging solutions in ASEAN
Betamek Bhd., an original design manufacturer and provider of electronics manufacturing services for the automotive industry, has announced a memorandum of understanding (MOU) with Jiangsu Yibang New Energy Technology Co. Ltd., a mainland Chinese company known for its expertise in new-energy vehicle charging protocol conversion technologies. Betamek, through its subsidiary Betamek Research Sdn. Bhd., aims to collaborate with Yibang in areas such as technical research and development, supply...
Volkswagen to integrate Xpeng's autonomous driving technology in China EVs by 2026
Volkswagen plans to incorporate Xpeng's autonomous driving technology, XNGP, into its China electric vehicles starting in 2026, with the first model being a midsize sport utility vehicle developed jointly with Xpeng. Initially, autonomous driving development was assigned to Cariad China, Volkswagen's software division. In July 2023, Volkswagen acquired a 4.99% stake in Xpeng for €700 million. By early 2024, both companies confirmed their collaboration on two midsize SUVs expected to launch in ...
Quintauris collaborates with Everspin Technologies to enhance reliability of RISC-V platforms
Quintauris, the company founded as a single source to enable compatible RISC-V–based products, and Everspin Technologies, a leader in magnetoresistive RAM (MRAM) and spin-transfer torque MRAM (STT-MRAM), announced a strategic collaboration to bring advanced memory solutions into the Quintauris ecosystem. The collaboration aims to strengthen the reliability and safety of RISC-V–based platforms, particularly for automotive, industrial and edge applications where data persistence, ...
A new tug of war for semiconductors: data centers vs. automakers
The automotive semiconductor market has been navigating a period of unusual volatility. On one side, near-term demand pressures are easing. The slowdown in electric vehicle adoption is reducing average chip content per vehicle, since EVs typically contain significantly more semiconductors than internal combustion models. Tariffs are further dampening global vehicle demand. S&P Global Mobility estimates suggest up to 0.6 million fewer vehicles will be produced in 2026 because of trade barrier...
Keysight Technologies enhances EV production testing with new EV2020B and EV2020BE platforms
Keysight Technologies has enhanced its end-of-line (EOL) test portfolio with the introduction of the EV2020B EV Manufacturing Functional Test Platform and the EV2020BE EV Manufacturing Functional Test Platform for Electric Vehicle Supply Equipment (EVSE). These new solutions offer automakers and EVSE manufacturers a scalable and flexible production testing approach, aiming to accelerate time-to-market, reduce costs, and ensure compliance with evolving industry standards. According to a report...
Hesai Technology to reach lidar production milestone by 2025
Hesai Technology announced that it will produce its 1-millionth lidar unit by 2025, making it the first lidar company to reach this production milestone annually, according to a press release on Oct. 3. The company said that its achievement showcases the company's ability to manufacture large-scale, high-quality lidar efficiently and aligns with Hesai's corporate vision to enable 1% of vehicles worldwide with 3D perception by 2025. Meanwhile, Keysight Technologies has expanded its end-of-line...
AutoTechInsight Weekly - 6 October 2025
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Codasip earns TÜV SÜD safety certification for L735 and L739 processor cores
In a press release on Oct. 1, Codasip announced that its high-performance embedded processor cores, the Codasip L735 and Codasip L739, have gained TÜV SÜD certification for functional safety. The L735 has been certified to ASIL-B, while the L739 has attained certification to ASIL-D Automotive Safety Integrity Level as per ISO 26262 standards. These certifications affirm that the processor IPs fulfill stringent functional safety requirements crucial for automotive applications, making them read...
Forvia eyes more than €1 billion in annual revenue from India within the next five years
Forvia is expanding its presence in the Indian automotive market with goal to generate more than €1 billion in revenue within the next five years, Autocar Professional reported Oct. 2. The French automotive supplier, which is growing at approximately 11% in India, plans to achieve this revenue target through an investment of approximately €218 million, focusing on local manufacturing and advanced technology. Martin Fischer, group CEO of Forvia, has emphasized India's growing importan...
TE Connectivity launches new electronic control unit connector portfolio for software-defined vehicles
TE Connectivity (TE) has launched its Inside Device Connectivity portfolio to address the evolving requirements of automotive electronic control units (ECUs) and next-generation vehicle architectures, including software-defined vehicles (SDVs). The new lineup includes board-to-board, wire-to-board, flex-to-board and wire-to-wire connector solutions engineered for compact, high-performance applications within zonal architectures and key systems such as: Onboard charger (OBC), inverter...
Sony Semiconductor announces IMX775 CMOS camera sensor for advanced in-cabin automotive monitoring
Sony Semiconductor Solutions announced the upcoming release of the IMX775 CMOS RGB-IR image sensor, featuring the smallest pixel size of 2.1 micron (µm). This sensor combines RGB and infrared (IR) imaging on a single chip, offering a resolution of approximately 5 effective megapixels, designed specifically for in-cabin monitoring cameras. This development comes amid increasing demands for advanced safety performance in automobiles, with laws mandating the monitoring of driver status and passeng...
Tobii and STMicroelectronics launch mass production of advanced in-cabin sensing technology
Tobii and STMicroelectronics have commenced mass production of an advanced interior sensing system for a premium European carmaker, enhancing driver and passenger monitoring. This cost-effective solution uses a single camera that integrates Tobii's interior-sensing technology with STMicroelectronics' imaging sensors, offering high-quality imaging both in daytime and nighttime environments. Adrian Capata,  senior vice president of Tobii Autosense, highlighted the collaboration with STMi...
Innoviz Technologies secures ISO/IEC 17025:2017 certification enhancing lidar testing capabilities
Innoviz Technologies announced that its hardware qualification testing laboratories have received the ISO/IEC 17025:2017 certification. This certification is an internationally acclaimed standard that confirms the competence of testing and calibration laboratories. This achievement distinguishes Innoviz as among the limited number of lidar companies with accredited in-house testing capabilities, which facilitates faster testing durations, parallel product development and an expedited time to mar...
Mercedes-Benz collaborates with Athos Silicon to enhance autonomous driving technology
Mercedes-Benz has announced a strategic collaboration with Athos Silicon, a semiconductor company formed by former engineers from Mercedes-Benz Research & Development North America (MBRDNA). This partnership focuses on advancing the adoption of advanced chiplet architecture for next-generation autonomous driving platforms. The initiative showcases Mercedes-Benz's innovation in Silicon Valley, California, and commitment to developing strategic ecosystems. The company's research and develop...
GlobalFoundries partners with Egis to develop new direct time-of-flight sensors on 55-nm platform
At its annual Technology Summit in Shanghai, GlobalFoundries (GF) announced a collaboration with Egis Technology to develop new direct time-of-flight (dToF) sensors on GF's 55-nanometer (nm) platform, as reported in a press release on Sept. 25. The innovation aims to support smart sensing technologies in smart mobile, internet of things, and automotive end markets. GF has introduced its first-generation front-side illuminated single-photon avalanche diode (FSI SPAD) device, which boasts super...
ROHM unveils new smart switches optimized for zonal controllers
ROHM has introduced a new series of high-side smart switches, known as Intelligent Power Devices (IPDs), with advanced current-sensing capabilities and ON resistances ranging from 9 milliohm to 180 milliohm. These switches are designed to protect loads and subsystems from issues such as overcurrent, overvoltage and overtemperature, ensuring the reliable operation and protection of sensitive automotive components such as lighting, door locks and power windows. They also offer enhanced safety feat...
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